Removal of tACS artefact: A simulation study for algorithm comparison

Federico Barban, Stefano Buccelli, Dante Mantini, Michela Chiappalone, Marianna Semprini

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Non invasive brain stimulation is a widely used technique for several applications, generally aimed at modulating brain activity and thus behavior. While the behavioral effects can be monitored during the application of the stimulation, the electrophysiological correlates, such as electroencephalography (EEG), cannot, because the stimulation artifact dramatically affects the recorded signals. Here we addressed this problem and we analyzed the artifact that transcranial alternating current stimulation (tACS) leaves on EEG traces. We found that the stimulation noise adds itself non-linearly to the EEG signal and spectral analysis revealed a peak centered at the stimulation frequency. We then created a synthetic dataset by adding to real EEG traces numerically generated signals, matching the characteristics of the tACS artifact. We used this data to test a set of artifact removal techniques based on blind source separation (BSS) methods and wavelet decomposition and we found that the best performing technique is independent component analysis (ICA).

Original languageEnglish
Title of host publication9th International IEEE EMBS Conference on Neural Engineering, NER 2019
PublisherIEEE Computer Society
Pages393-396
Number of pages4
ISBN (Electronic)9781538679210
DOIs
Publication statusPublished - May 16 2019
Event9th International IEEE EMBS Conference on Neural Engineering, NER 2019 - San Francisco, United States
Duration: Mar 20 2019Mar 23 2019

Publication series

NameInternational IEEE/EMBS Conference on Neural Engineering, NER
Volume2019-March
ISSN (Print)1948-3546
ISSN (Electronic)1948-3554

Conference

Conference9th International IEEE EMBS Conference on Neural Engineering, NER 2019
Country/TerritoryUnited States
CitySan Francisco
Period3/20/193/23/19

ASJC Scopus subject areas

  • Artificial Intelligence
  • Mechanical Engineering

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